While typical liquid cooling for PCs usually requires a certain amount of space, it will seem amazing to see that in a phone like the Galaxy S7. It’s just been a few days since Samsung revealed the Galaxy S7 and S7 edge, but it’s amazing that someone managed to get their hands on one for a tear-down.
A Russian-based tech blog got their hands on the S7 somehow and dismantled the phone to get to know the inner construction. After disassembling the phone, it is found that there is a liquid filled copper pipe over the Exynos 8890 and the Snapdragon 820 SoCs. Naturally, this should help to draw out the heat from the SoCs quicker and transfer it to a different section where the heat can easily dissipate. Copper is also a very good heat exchanger.
What should also be noted is that the phone that adhesive is used to glue the rear cover on the metal frame. There wasn’t any type of rubber housing present which would make the device watertight and even qualify for an IP68 waterproofing rating. Even though it requires one to remove the rear side to service the phone, the repair rate for these units would result in a higher cost.
It is also pointed that the SIM/Micro SD card tray has a rubberised ring. Though the phone isn’t watertight, rubberized tray probably protects from moisture.
— Dawn of Tech (@DawnofTech) February 26, 2016